Method for manufacturing device
US7141515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Dec 26, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat.The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.