Image sensor with protective package structure for sensing area
US7141782B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | May 24, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
Abstract
An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A perimeter of the chip is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.