Semiconductor manufacturing device and semiconductor manufacturing method
US7141995B2 · kind B2 · utility
1Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Nov 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.