Electrostatic chuck of semiconductor fabrication equipment and method for chucking wafer using the same
US7142406B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Dec 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electrostatic chuck having electrodes of which polarities are periodically inverted, and a method for chucking wafers using the electrostatic chuck. The electrostatic chuck of the present invention includes an electrode part including first and second electrodes having different polarities and generating electrostatic charge for fixing a wafer, an electric source part having a first electric source for supplying positive and negative electricity to the respective first and second electrodes and a second electric source for supplying the negative and positive electricity to the respective first and second electrodes, and a polarity inversion part for inverting the polarities of the first and second electrodes every cycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.