Laser cutting method and apparatus for optical fibres or waveguides
US7142741B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 25, 2001 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Dec 24, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A cutting method and apparatus are provided to cut a portion of an optical fibre or waveguide with a laser beam. The proposed cutting action takes advantage of the sharp cutting edge of a laser beam generated so as to have a predetermined asymmetric intensity distribution. In operation, a prescribed amount of the beam distribution is impinged on the fibre or waveguide portion and causes the portion to ablate or vaporise so as to effect a cut at the portion in dependence upon the impingement. No translation of the laser beam across the fibre or waveguide is effected during cutting. The proposed cutting action bears definite advantages over conventional cutting techniques and finds utility for many optical fibre or waveguide applications. For example, the proposed cutting action can produce a substantially flat optical fibre or waveguide surface or a lens of enhanced quality at the end of the fibre or waveguide portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.