Method and system for processing semiconductor wafers
US7143660B2 · kind B2 · utility
0Cited by
4References
6Claims
0Family size
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Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Aug 29, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/905
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for processing semiconductor wafers includes processing a semiconductor wafer in a processing chamber having upper and lower chambers, decoupling the upper chamber from the lower chamber, cleaning the upper chamber, determining, while decoupled, that a leak rate and a particle count for the upper chamber meets predetermined criteria, and coupling the upper chamber to the lower chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.