Transponder label
US7143951B2 · kind B2 · utility
0Cited by
16References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Mar 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A transponder label including a transponder film, a chip mounted on the transponder film and an adhesive layer. The adhesive layer has a thickness that is equal to the thickness of the chip. The adhesive layer also has a recess in an area of the chip, which recess has a contour that matches the shape of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.