Multilayer microcavity devices and methods

US7144486B1 · kind B1 · utility

Assignee

• Board of Trustees of the University of Arkansas · US

Inventors

• Ingrid Fritsch · Fayetteville, US
• Charles S. Henry · Fort Collins, US
• Benjamin P. Bowen · Tempe, US
• Walter Vandaveer · Lawrence, US
• Nicole Bratcher · Pittsburg, US

Key dates

• Filing date: Dec 12, 2001
• Grant date: Dec 5, 2006
• Expiry date: Aug 17, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N27/403
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Microcavities and micropores that are microscopic (<1 mm) in width and depth and contain any number of individually-addressable electrodes, separated by insulators, along the walls of each cavity. The conducting materials, and the insulator materials can be deposited alternately onto a starting substrate, which is typically an oxidized silicon wafer or polyimide film, but may be any substrate that shows good adhesion to the materials layered on it. The cavities are etched through these layers, perpendicular to the plane of the substrate, exposing the layers at their edges. Pores may be carved entirely through the device.