Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced
US7144745B2 · kind B2 · utility
47Cited by
37References
42Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2001 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Aug 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of producing a crystalline substrate based device includes forming a microstructure on a crystalline substrate. At least one packaging layer is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.