Semiconductor device with pins and method of assembling the semiconductor device
US7144762B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Dec 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged portion at one end thereof and an engaging portion at the other end thereof. An engaging member is provided to engage with the engaging portions of the pins that pass though the holes in the heat sink and the holes in the substrate and protrude from the substrate. Springs are arranged between the enlarged portions of the pins and the heat sink. In assembling the semiconductor device, the pins are held collectively by a holding member, and after the semiconductor device is assembled, the holding member is removed from the pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.