Curable resin composition
US7144953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L43/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a composition, which is easy to produce because of high ease of handling the starting materials. The composition exhibits excellent transparency, and a product prepared using the composition exhibits excellent mechanical properties and adhesive properties.The curable resin composition contains (A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds; (B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C1–C2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having C7–C9 alkyl; and (C) a curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.