Apparatus for heating a board product including glued wood
US7145117B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Nov 19, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B2210/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for heating a board product containing glued wood is disclosed. The apparatus includes a heating chamber through which the board product passes. The board product passes through a heating field in the heating chamber provided by means of microwave energy applied perpendicular to the board plane. The clearances between respective side edges of the board and side walls of the heating apparatus are filled by slide pieces made of a material that has a small loss tangent and a low dielectric factor. The slide pieces correct the form of the heating field affecting the board plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.