Silicone metalization
US7145229B2 · kind B2 · utility
7Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2002 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Nov 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.