Electronic apparatus
US7145231B2 · kind B2 · utility
12Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | May 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.