Apparatus, method, and kit for probing a pattern of points on a printed circuit board
US7145352B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2004 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Aug 13, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus, method, and kit for probing a pattern of points on a first printed circuit board are disclosed. In one exemplary embodiment, the apparatus includes a probe having i) a plurality of compression interconnects to probe the pattern of points on the first printed circuit board, and ii) a plurality of fixed pins that are electrically coupled to the compression interconnects. The fixed pins extend from the probe opposite the compression interconnects. The apparatus further includes a flexible wire interconnect having first and second sets of electrically coupled connectors, the first set of which is coupled to the fixed pins of the probe. A second printed circuit board has at least one first connector that is electrically coupled to at least one second connector. The at least one first connector is coupled to the second set of connectors of the flexible wire interconnect, and the at least one second connector is configured to couple to a test instrument.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.