Backside cooling apparatus for modular platforms
US7145774B2 · kind B2 · utility
8Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2003 |
| Grant date | Dec 5, 2006 |
| Priority date | — |
| Expiry date | Nov 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.