Lightweight heat sink
US7147041B2 · kind B2 · utility
27Cited by
50References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jan 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. The body portion is joined to the second surface of the base portion and is formed of a stack of corrugated sheets of one or more metal foils arranged to form a cellular, honeycomb-like structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.