Packaging platform having an adjustable thickness
US7147107B2 · kind B2 · utility
3Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2003 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | May 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.