Thickness control method and double side polisher
US7147541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2006 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Feb 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.