Method for surface treatment of polymeric substrates

US7147758B2 · kind B2 · utility

Assignees

• L'Air Liquide, Société Anonyme à Directoire et Conseil de Surveillance pour l'Étude et l'Exploitation des Procédés Georges Claude · FR
• Softal Electronic Erik Blumenfeld GmbH & Co. · DE

Inventors

• Panayotis Cocolios · Rambouillet, FR
• François Coeuret · Guyancourt, FR
• Franck Forster · Hamburg, DE
• Jean-Louis Gelot · Paris, FR
• Bernd Martens · Uetersen, DE
• Eckhard Prinz · Schwarzenbek, DE
• Geraldine Rames-Langlade · Chaville, FR
• Alain Villermet · Viroflay, FR

Key dates

• Filing date: Jan 22, 2001
• Grant date: Dec 12, 2006
• Expiry date: Jan 29, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29C59/12
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

Methods for treating polymeric substrates by placing the substrate in a gaseous mixture and subjecting it to a dielectric barrier electrical discharge. The gaseous mixture, which has a pressure around atmospheric, contains a carrier gas, a reducing gas and an oxidizing gas. The amount of the oxidizing gas in the gas mixture is between about 50 ppm and about 2000 ppm by volume, while the amount of the reducing gas in the gas mixture is between about 50 ppm and 30000 ppm by volume.