Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US7147767B2 · kind B2 · utility
4Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Mar 11, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.