Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
US7148148B2 · kind B2 · utility
4Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2002 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Feb 12, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/022
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.