Hybrid inorganic/organic low k dielectric films with improved mechanical strength
US7148263B2 · kind B2 · utility
1Cited by
1References
38Claims
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Key dates
| Filing date | Jul 14, 2004 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Apr 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02216
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a nanoporous silica dielectric film having improved mechanical strength. A composition is formed which comprises in admixture a porogen, a solvent, a catalyst and a combination of silicon containing pre-polymers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.