Hot melt adhesive
US7148284B2 · kind B2 · utility
4Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2004 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | May 21, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesives that contain an N-alpha olefin wax have substantially improved open times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.