Propylene polymer based compounds and heat-sealable multi-layer sheets containing them
US7148289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2002 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jul 25, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polypropylene composition is disclosed, having a sealing initiation temperature below 80° C., and containing less than 1% by weight of monomeric units derived from ethylene with respect to the total weight of the composition, and comprising:—from 35 to 68% by weight of a random copolymer of propylene (copolymer (A)) containing 16 to 30% by weight of monomeric units derived from I-butene and from 0 to 0.5% by weight of monomeric units derived from ethylene with respect to the total weight of copolymer (A), and—from 65 to 32% by weight of a random copolymer of propylene (copolymer (B)) containing 35 to 55% by weight of monomeric units derived from I-butene and from 0 to 1% by weight of monomeric units derived from ethylene with respect to the total weight of copolymer (B). Heat-sealable sheets containing a sealing layer of the above composition are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.