Wiring substrate, display device, semiconductor chip, and electronic equipment
US7148427B2 · kind B2 · utility
9Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2001 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Feb 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate is formed of a plurality of metal wirings 14e formed on a substrate 7c. A guard wiring 29 fabricated of an electrically conductive oxide such as ITO is interposed between at least a pair of adjacent ones of a plurality of metal wirings 14e. When voltages V1, V2, V3, and V4 applied to the metal wirings 14e are related to be V1>V2>V3>V4, a guard wiring 29 is present between a metal wiring 14e functioning as an anode and a metal wiring 14e functioning as a cathode, and the anode metal wiring 14e is prevented from being corroded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.