Method and apparatus for laser marking by ablation
US7148447B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2006 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jan 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic optical device so that the beam is controllably modified into an elliptical irradiance pattern. The modified beam is propagated through a scanning optical system with an objective lens to image a controlled elliptical spot on the target. In one embodiment, the relative orientations of the devices along an optical axis are controlled to modify the beam irradiance pattern to obtain an elliptical shape while the absolute orientation of the devices controls the orientation of the elliptical spot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.