Monitored laser shock peening
US7148448B2 · kind B2 · utility
16Cited by
29References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2003 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Mar 11, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D10/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pulse laser is configured for projecting a pulsed laser beam at a target site on a fluid film atop a workpiece for laser shock peening the workpiece. The fluid film is monitored by a probe laser which projects a probe laser beam at the target site, and an optical detector which detects reflection of the probe beam from the target site. The pulse laser is coordinated by the detector in order to emit the pulsed beam in response to the condition of the monitored film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.