Heat sink for printed circuit board components
US7148452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2001 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jun 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a heat sink for cooling a component. The component may be one of several components on a circuit board. The heat sink includes a tubular body and a plurality of internal fins. The tubular body has an interior surface and an exterior surface. At least a portion of the exterior surface being substantially flat. The plurality of internal fins extend from the internal surface and are generally symmetric around a center line of the tubular body. The substantially flat portion of the tubular body contacts the component to remove heat from the component. The heat sink may further include a plurality of exterior fins extending from the exterior surface of the tubular body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.