Materials for electronic devices
US7148577B2 · kind B2 · utility
2Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improved materials for use in the fabrication of electronic devices and devices made therewith are described. The materials comprise fillers having a negative coefficient of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.