Liquid cooled heat sink with cold plate retention mechanism
US7149087B2 · kind B2 · utility
31Cited by
26References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Sep 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.