Systems and methods for detecting defects in printed solder paste
US7149344B2 · kind B2 · utility
9Cited by
14References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2005 |
| Grant date | Dec 12, 2006 |
| Priority date | — |
| Expiry date | Jul 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.