Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings
US7151127B2 · kind B2 · utility
3Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2004 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to the use of thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during a thermoplastic conversion into commodity goods in discontinuous processes in particular injection moulding, and continuous processes such as the extrusion of films, fibers, tubes and jacketings containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.