Digital micromirror device mounting system
US7151670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2005 |
| Grant date | Dec 19, 2006 |
| Priority date | — |
| Expiry date | May 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N9/3141
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A projection device is provided, wherein the projection device includes a digital micromirror device, a circuit board that further includes a first face and a second face, an integrated heat sink/stiffener; and a plurality of engagement mechanisms, wherein the plurality of engagement mechanisms is adapted to operatively couple the digital micromirror device to the first face of the circuit board and to secure the integrated heat sink/stiffener to the second face of the circuit board; and wherein the integrated heat sink/stiffener is adapted to provide structural support to the circuit board and to draw thermal energy away from the digital micromirror device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.