In situ molded thermal barriers
US7152385B2 · kind B2 · utility
103Cited by
75References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jul 16, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16L5/04
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Methods, systems, and devices for installing barriers in openings of gaps in or between structures such as walls, ceilings, and floors are described herein. At least one barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is preferably operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to create a barrier in the hole or gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.