Microelectromechanical structure and a method for making the same
US7153443B2 · kind B2 · utility
3Cited by
65References
57Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jan 19, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microstructure and the method for making the same are disclosed herein. The microstructure has structural members, at least one of which comprises an intermetallic compound. In making such a microstructure, a sacrificial material is employed. After completion of forming the structural layers, the sacrificial material is removed by a spontaneous vapor phase chemical etchant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.