Addition-crosslinking silicone resin compositions
US7153914B2 · kind B2 · utility
7Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jun 20, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Addition-crosslinking silicone resin compositions containing selected high functionality addition curable organosilicon compounds can be cured at relatively low temperatures and can produce highly transparent, hard polymers which are suitable for many uses, in particular for the potting or embedding of electrical componts such as LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.