Patent · US Expired

Method and semi-product for producing a chip card with a coil

US7154758B2 · kind B2 · utility

5Cited by

3References

9Claims

0Family size

Assignee

GIESECKE & DEVRIENT GMBH · DE

Inventors

Ando Welling · Isen, DE
Matthias Bergmann · Hersbruck, DE
Joachim Hoppe · Munich, DE

Key dates

Filing date	May 7, 2002
Grant date	Dec 26, 2006
Priority date	—
Expiry date	Feb 27, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49147
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.