Laser diode module, laser apparatus and laser processing apparatus
US7154926B2 · kind B2 · utility
12Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jul 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.