Infrared sensor package
US7157709B2 · kind B2 · utility
1Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2003 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/34
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.