Integrated circuit device
US7157742B2 · kind B2 · utility
47Cited by
41References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2003 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.