Surface mount package for a high power light emitting diode
US7157744B2 · kind B2 · utility
42Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2003 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Nov 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.