Piezoelectric device
US7157836B2 · kind B2 · utility
21Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Oct 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/0547
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric device including an IC chip mounted on an inner bottom surface of a package, and a piezoelectric vibrating reed electrically and mechanically connected onto a TAB tape in which a lead is provided on a surface of a resin tape. The TAB tape to which the piezoelectric vibrating reed has been joined is mounted in the package, whereby the piezoelectric vibrating reed is arranged above the IC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.