Ground interconnects
US7158350B1 · kind B1 · utility
3Cited by
16References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2002 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Dec 9, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for grounding a flexure of a head suspension assembly to a moving support such as an actuator arm or an E block close to a preamplifier, write driver or other wiring such as a flexible circuit located on the moving support in a disk drive assembly, including connecting a metal substrate layer of the flexure to a ground on the moving support closely adjacent the preamplifier or flexible circuit to minimize ground loop interference with signals on the traces. The invention includes a variety of arrangements to secure the metal substrate layer to the moving support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.