Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard
US7158381B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Dec 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.