Multi-link segmentation and reassembly sublayer for bonding asynchronous transfer mode permanent virtual circuits
US7158523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Jan 2, 2007 |
| Priority date | — |
| Expiry date | Mar 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2012/5672
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described for bonding asynchronous transfer mode permanent virtual circuits using a multi-link segmentation and reassembly sublayer. A method includes: transforming a stream of asynchronous transfer mode cells into a stream of bonded asynchronous transfer mode cells; demultiplexing the stream of bonded asynchronous transfer mode cells into a plurality of streams of inverse multiplexed bonded asynchronous transfer mode cells; and transmitting the plurality of streams of inverse multiplexed bonded asynchronous transfer mode cells to a remote location via a plurality of permanent virtual circuits, characterized in that the transmitted plurality of streams of inverse multiplexed bonded asynchronized transfer mode cells can be multiplexed into a multiplexed stream of asynchronized transfer mode cells after transmission via at least two permanent virtual circuits, which compose the plurality of permanent virtual circuits, that do not have an identical bit-rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.