Hotspot coldplate spray cooling system
US7159414B2 · kind B2 · utility
11Cited by
29References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2004 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Dec 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.