Bending device with cutting mechanism
US7159430B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2005 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Apr 28, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D7/024
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The bending device with a cutting mechanism has a bending die corresponding to a desired bending shape, a bending arm that rotates on the bending die, and a clamping die on the bending arm that moves toward a longitudinal workpiece. Corresponding to rotation of the bending arm, the clamping die is rotated around the bending die in order to bend the workpiece. A cutter is provided on the bending arm. The cutter is in a pointed shape having the center of a leading end protruding, and moves toward a workpiece. The clamping die has a groove wherein the cutter can be slid therein. The cutter moves linearly toward a workpiece and cuts the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.