Micromachined gyroscopic sensor with detection in the plane of the machined wafer
US7159460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2003 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Nov 11, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5747
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.