Method of soldering and solder compositions
US7159756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2003 |
| Grant date | Jan 9, 2007 |
| Priority date | — |
| Expiry date | Dec 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.